Scholarlink

One of the most critical failure mechanisms of solder joints is material fatigue. Repeated inelastic deformations cause the accumulation of microdefects and, after a certain number of load cycles, the final failure. This paper presents a modeling approach for the prediction of damage evolution in Sn–Ag–Cu alloys. Constitutive equations are explicitly derived for combined elasticity, plasticity, creep, and uniform isotropic damage. All required material parameters are identified and possible material test procedures are discussed. The modeling approach is demonstrated for a single solder ball subjected to cyclic mechanical loading.

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Elastic–Plastic–Creep Deformation and Damage in Sn–Ag–Cu Solder Alloys

  • 章节

  • 发表日期：

    2025年

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  • Torsten Hauck,
  • Aleksandr Morozov,
  • Wolfgang H. Müller

摘要

One of the most critical failure mechanisms of solder joints is material fatigue. Repeated inelastic deformations cause the accumulation of microdefects and, after a certain number of load cycles, the final failure. This paper presents a modeling approach for the prediction of damage evolution in Sn–Ag–Cu alloys. Constitutive equations are explicitly derived for combined elasticity, plasticity, creep, and uniform isotropic damage. All required material parameters are identified and possible material test procedures are discussed. The modeling approach is demonstrated for a single solder ball subjected to cyclic mechanical loading.