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In microelectromechanical systems (MEMS), silicon thin films are used as a main material and work under the constant or cyclic tensile loads. The static and fatigue strength of silicon thin films have also been studied, but their mechanical behavior and lifetime prediction are still being investigated through experiments. In this paper, a fatigue test structure under tensile load for micro-sized polysilicon thin film specimen is designed. The load applied to the test specimens is generated by a comb-shaped electrostatic actuator. This new test structure allows experiments to be conducted with shorter time about 11.6 days in comparison to 231.5 days of the previous structure to obtain 1010 cycles.

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An On-Chip Fatigue Tensile Test Structure for Polysilicon Thin Film

  • 会议论文

  • 发表日期：

    2025年

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  • Vu Le Huy,
  • Nguyen Chi Hung

摘要

In microelectromechanical systems (MEMS), silicon thin films are used as a main material and work under the constant or cyclic tensile loads. The static and fatigue strength of silicon thin films have also been studied, but their mechanical behavior and lifetime prediction are still being investigated through experiments. In this paper, a fatigue test structure under tensile load for micro-sized polysilicon thin film specimen is designed. The load applied to the test specimens is generated by a comb-shaped electrostatic actuator. This new test structure allows experiments to be conducted with shorter time about 11.6 days in comparison to 231.5 days of the previous structure to obtain 1010 cycles.