In this study, a prototype of a Passive Vibration Isolator (PVI) was modeled, designed, and verified by both theoretical and experimental methods. The PVI prototype is capable of isolating a maximum of 20 kg payload in multiple degree-of-freedom (DOFs) at a low range of excitation frequency. A model namely Double Spring Damper Mass (DSDM) was used to model the dynamic behavior. The vibration characteristic was also simulated by the use of Finite Element Method (FEM) method. The resonance frequency in both simulation methods has a difference of 0.1 Hz. Then, the PVI prototype was experimented with an industrial shaker and a system of accelerometer sensors at various actuation frequencies. The experiment showed a relative fitting between simulation and experimental data in which the resonance in a single axis is in the range of 8–14.2 Hz. The PVI prototype has high potential in board control bandwidth of precise optical systems and high-sensitivities applications.

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An Engineering Approach to Design a Passive Vibration Isolator for High-Weight Payload

  • Nguyen Duc Nam

摘要

In this study, a prototype of a Passive Vibration Isolator (PVI) was modeled, designed, and verified by both theoretical and experimental methods. The PVI prototype is capable of isolating a maximum of 20 kg payload in multiple degree-of-freedom (DOFs) at a low range of excitation frequency. A model namely Double Spring Damper Mass (DSDM) was used to model the dynamic behavior. The vibration characteristic was also simulated by the use of Finite Element Method (FEM) method. The resonance frequency in both simulation methods has a difference of 0.1 Hz. Then, the PVI prototype was experimented with an industrial shaker and a system of accelerometer sensors at various actuation frequencies. The experiment showed a relative fitting between simulation and experimental data in which the resonance in a single axis is in the range of 8–14.2 Hz. The PVI prototype has high potential in board control bandwidth of precise optical systems and high-sensitivities applications.