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The paper studies the reliability of the soldered coupling of the quartz glass with the stainless-steel housing. This connection unit is used in the design of ruggedized detectors with dimensions Ø27 × 18 mm based on hygroscopic scintillators. The analysis of the methods and materials for coupling the parts of this type of detectors is carried out. The possibility of using ultrasonic soldering and lead-free solders to ensure the sealing of the detector housing is considered. The use of high-temperature solders with a melting point above 200 °C ensure the sealing of the ruggedized detector design. The reliability of the glass-solder connection is calculated using the Engelmaier-Wild model. The obtained data correspond well to the experimental results. The optimal solder thickness allowing withstanding the maximum number of loading cycles is determined. Temperature and sealing tests of the housing with the soldered glasses are carried out. The presence of internal stresses in the soldered glasses, leading to the degradation of scintillation characteristics of NaI:Tl detectors, is established.

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Reliability of Quartz Glass-to-Stainless Steel Connection Performed by Ultrasonic Soldering for NaI:Tl Ruggedized Detector

  • 会议论文

  • 发表日期：

    2025年

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  • Oleksandr Bobovnikov,
  • Volodymyr Klitnoi,
  • Tetiana Nepokupna,
  • João Pedro Mendonça,
  • Andrew Ruzmetov

摘要

The paper studies the reliability of the soldered coupling of the quartz glass with the stainless-steel housing. This connection unit is used in the design of ruggedized detectors with dimensions Ø27 × 18 mm based on hygroscopic scintillators. The analysis of the methods and materials for coupling the parts of this type of detectors is carried out. The possibility of using ultrasonic soldering and lead-free solders to ensure the sealing of the detector housing is considered. The use of high-temperature solders with a melting point above 200 °C ensure the sealing of the ruggedized detector design. The reliability of the glass-solder connection is calculated using the Engelmaier-Wild model. The obtained data correspond well to the experimental results. The optimal solder thickness allowing withstanding the maximum number of loading cycles is determined. Temperature and sealing tests of the housing with the soldered glasses are carried out. The presence of internal stresses in the soldered glasses, leading to the degradation of scintillation characteristics of NaI:Tl detectors, is established.