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This chapter introduces the tape-out process in semiconductor manufacturing. It discusses the semiconductor industry’s growth, the rising costs of chip design, and the industry’s segmentation into design, fabrication, assembly/packaging/test, and equipment manufacturing. The chapter also explores the rise of open-source tools in IC design, emphasizing their role in democratizing access to semiconductor fabrication, particularly through initiatives like DARPA’s Electronics Resurgence Initiative and the development of tools like OpenLane.

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Introduction

  • 章节

  • 发表日期：

    2025年

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  • Susana Ortega Cisneros,
  • Emilio Isaac Baungarten Leon,
  • Pedro Mejia Alvarez

摘要

This chapter introduces the tape-out process in semiconductor manufacturing. It discusses the semiconductor industry’s growth, the rising costs of chip design, and the industry’s segmentation into design, fabrication, assembly/packaging/test, and equipment manufacturing. The chapter also explores the rise of open-source tools in IC design, emphasizing their role in democratizing access to semiconductor fabrication, particularly through initiatives like DARPA’s Electronics Resurgence Initiative and the development of tools like OpenLane.