The field of 3D photonics is advancing rapidly, driven by the demand for photonic devices that are not only faster and more efficient but also highly compact and capable of supporting new applications. Innovations in 3D integration techniques—such as stacking multiple layers of photonic components, creating complex waveguide architectures, and employing advanced materials like silicon photonics and lithium niobate—are pushing the boundaries of what photonic devices can achieve. These advancements are particularly impactful in fields like telecommunications, where high data throughput and minimal latency are crucial, and computing, where photonic processors and interconnects promise to revolutionize data processing speeds and energy efficiency.