System-On-Chip Integration
摘要
Chapter 4 introduced the circuits designed for remote powering and the power conversion chain of the implanted units, along with their corresponding measurement results. Furthermore, Chap. 5 presented the bi-directional wireless data communication methods, supported by experimental results for each block. To evaluate the overall effectiveness of the system, the proposed circuits were integrated as a system-on-chip (SoC) and fabricated using TSMC 180 nm MM/RF technology. The final version of the system diagram includes all the blocks described in the preceding Chapters. This Chapter begins with a brief introduction and literature review on wirelessly powered SoCs for biomedical applications. The system architecture and the simulation and measurement results are also presented. The characterization of the SoC is achieved using wire bonding and chip-on-board packages. Printed circuit boards (PCBs) have been designed to verify the prototype.