Non-destructive testing (NDT) is a method used by industries to examine materials, parts, structures, or systems for any differences or defects, such as welding issues and electronic heating issues, without causing damage to the original materials. Thermography, a type of NDT, employs infrared cameras to detect defects characterized by temperature variations and produce thermal images. Thermography encompasses two main types: passive and active thermography. Passive thermography is primarily utilized for condition monitoring, while active thermography is geared towards defect detection. The kit involves an external heating source and an infrared detector to identify defects. In this project, a compact Active thermography system was developed employing the FLIR Lepton 3.1R infrared camera alongside a flash lamp and an induction coil as dual excitation source. This system successfully identified overheating issues in electronic PCBs, pinpointing CPU, and filter malfunctions, as well as overheated regions in metal materials. Active thermography finds applications across various sectors including electronic PCBs, metals, and composite materials. The portable nature of this active infrared thermography system enables the detection of defects in electronic components, including counterfeit ones prone to heating issues leading to damage. By pre-emptively identifying minor defects, it prevents damage caused by excessive heating before it occurs. Furthermore, this system proves instrumental in identifying machine failures and system malfunctions, thereby enhancing reliability across fields such as electrical wiring, electronics, mechanical systems, and machinery.