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This chapter explores cutting-edge packaging techniques for quantum computing, wearable devices, and future trends in IC packaging. It delves into quantum computing’s 2.5D and 3D integration, emphasizing security challenges and the quest for secure materials. For wearable gadgets, it discusses flexible substrates, miniaturization, and biocompatible materials, highlighting the importance of advanced packaging for comfort and durability. Future trends in IC packaging, including improvements in interconnects and the potential of nanomaterials and machine learning, are also addressed, providing readers with insights into upcoming advancements.

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Quantum Computing, Wearables, and Next-Gen IC Packaging

  • 章节

  • 发表日期：

    2025年

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  • Navid Asadizanjani,
  • Himanandhan Reddy Kottur,
  • Hamed Dalir

摘要

This chapter explores cutting-edge packaging techniques for quantum computing, wearable devices, and future trends in IC packaging. It delves into quantum computing’s 2.5D and 3D integration, emphasizing security challenges and the quest for secure materials. For wearable gadgets, it discusses flexible substrates, miniaturization, and biocompatible materials, highlighting the importance of advanced packaging for comfort and durability. Future trends in IC packaging, including improvements in interconnects and the potential of nanomaterials and machine learning, are also addressed, providing readers with insights into upcoming advancements.