This chapter presents a thorough investigation into electrochemical deposition (ECD) and its significance in the advanced packaging industry [1]. It explores the historical development and evolution of ECD, along with associated technologies, implementation methodologies, and the industrial framework. The chapter also addresses equipment suppliers, technical challenges, and potential avenues for further research and trend analysis within the field. ECD emerges as a pivotal technology, offering precise control for applying thin layers of conductive material, thus forming a cornerstone for technological advancements in advanced packaging.