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This chapter offers an in-depth exploration of the physical vapor deposition (PVD) process and its pivotal role in advanced semiconductor packaging fabrication. It introduces various types of PVD techniques such as sputtering, thermal evaporation, magnetron sputtering, and cathodic arc deposition. Applications of PVD in back end of line (BEOL) processing and semiconductor packaging are extensively discussed, including under bump metallization, seed layers for RDL, hybrid bonding, and Cu-Cu bonding. Through this comprehensive overview, the chapter provides valuable insights into the significance and diverse applications of PVD in the fabrication of advanced semiconductor packages.

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Physical Vapor Deposition in Advanced Semiconductor Packaging

  • 章节

  • 发表日期：

    2025年

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  • Navid Asadizanjani,
  • Himanandhan Reddy Kottur,
  • Hamed Dalir

摘要

This chapter offers an in-depth exploration of the physical vapor deposition (PVD) process and its pivotal role in advanced semiconductor packaging fabrication. It introduces various types of PVD techniques such as sputtering, thermal evaporation, magnetron sputtering, and cathodic arc deposition. Applications of PVD in back end of line (BEOL) processing and semiconductor packaging are extensively discussed, including under bump metallization, seed layers for RDL, hybrid bonding, and Cu-Cu bonding. Through this comprehensive overview, the chapter provides valuable insights into the significance and diverse applications of PVD in the fabrication of advanced semiconductor packages.