Semiconductor packaging is crucial for protecting and enhancing the functionality of ICs, providing thermal management, electrical connectivity, and signal integrity preservation. The assembly and testing stages are pivotal in creating reliable electronic products, involving intricate procedures tailored to encapsulate and safeguard semiconductor chips. Various packaging methods exist, each with distinct advantages for ensuring the reliability, performance, and downsizing of modern electronics. Bonding techniques play a crucial role in linking semiconductor dies to package substrates, influencing electrical and mechanical performance. This chapter provides a comprehensive overview of bonding techniques, including TSV’s, wire bonding, flip chip bonding, micro bumps, wafer bonding, and hybrid bonding, exploring their principles, applications, advantages, and limitations in advanced packaging.