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This chapter provides a comprehensive overview of integrated circuit (IC) packaging development, focusing on both traditional techniques and modern assembly processes. Beginning with a historical perspective, it traces the evolution of packaging from early integrated circuits to complex systems, emphasizing challenges faced and solutions implemented. The importance of packaging in contemporary electronics is underscored, along with an introduction of packaging ecosystem.

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Introduction to IC Packaging Development and Assembly Processes

  • 章节

  • 发表日期：

    2025年

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  • Navid Asadizanjani,
  • Himanandhan Reddy Kottur,
  • Hamed Dalir

摘要

This chapter provides a comprehensive overview of integrated circuit (IC) packaging development, focusing on both traditional techniques and modern assembly processes. Beginning with a historical perspective, it traces the evolution of packaging from early integrated circuits to complex systems, emphasizing challenges faced and solutions implemented. The importance of packaging in contemporary electronics is underscored, along with an introduction of packaging ecosystem.