Electronics and microsystem technology products have become an indispensable part of our lives and largely have enabled technical progress and the development of industrial and media society. The advancing miniaturization and thus the development towards the nano-packaging has posed a particular challenge in recent years. It needs corresponding non-destructive evaluation methods with high resolution like X-ray Computed Tomography to evaluate these technologies and to bring them to production lines. This chapter is intended to present the status of non-destructive testing methods for electronics packaging to users in research and production. The latest developments are also taken into account and the specifics of the electronics industry are discussed. The most parts of this publication base on the authors chapters in Bell et al. (“Reflow Technologie – Grundlagen des Reflowlötens, Teil 5: Möglichkeiten und Grenzen der Analytik an Lötstellen” (German edition) and accordingly “Reflow technology – fundamentals of reflow soldering, part 5: solder joint analysis opportunities and limitations” (English edition). Blaubeuren: Rehm Thermal Systems GmbH, 2019).