Engineering structures are susceptible to cracks and significant deformations. The increasing prevalence of heterogeneous structures underscores the growing urgency for flexible sensors. The piezoelectric properties of flexible sensors are sensitive to temperature changes. The encapsulation process complicates the force distribution within the sensing layer, thereby impeding the accurate measurement of strain in the test structure. This study proposes a multilayer strain transfer model that considers the temperature-dependent coefficient of thermal expansion. Initially, a five-layer strain transfer model is developed using the shear hysteresis theory, incorporating the thermal strain function and boundary conditions. Subsequently, the deformation along the length of the sensor and the temperature-dependent strain transfer coefficient is determined by solving the boundary strain function. The study analyzed the influence of temperature and material dimensions on the temperature parameters. Numerical simulation results indicate that strain transfer efficiency primarily relies on the thermal expansion coefficient and material dimensions, irrespective of temperature fluctuations. Additionally, the presence of folds at the ends of flexible sensors is attributed to the significant disparity between the coefficient of thermal expansion of the flexible material and the test structure. The proposed model effectively characterizes the strain interaction between the sensing layer and the structure, facilitating the calibration of measured data.