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Laser-activated selective electroless plating (LASELP) is a promising complementary manufacturing process employed in hybrid additive manufacturing (HAM) technology for the direct digital manufacturing of full-functional customized 3D electronics. However, most current LASELP technologies could only enable copper deposition on/within the polymer matrix, which largely limited the application scope of 3D customized electronics. Accordingly, an advanced LASELP-based HAM technology combining vat photopolymerization (VPP), laser-activation and electroless silver plating (ELP) is proposed to pattern silver layers on the photopolymer matrix, for expanding its application potential in the field of 3D electronics. Cu2(OH)PO4 is selected as the catalyst in this HAM technology, which has been proven effective for copper-based LASELP in our previous research. After laser activation, silver ELP can directly occur on the activated surface to deposit a dense and highly conductive layer. Finally, a 3D conformal anti-corrosion circuit board is fabricated and fully verifies this improved LASELP-based HAM technology.

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Functional Metallic Circuitries Created by Laser-Activated Selective Electroless Plating for 3D Customized Electronics

  • 会议论文

  • 发表日期：

    2025年

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  • Peiren Wang,
  • Hanqiang Zhang,
  • Xiaoyi Chen,
  • Zhen Chen,
  • Junhui Yang,
  • Ji Li

摘要

Laser-activated selective electroless plating (LASELP) is a promising complementary manufacturing process employed in hybrid additive manufacturing (HAM) technology for the direct digital manufacturing of full-functional customized 3D electronics. However, most current LASELP technologies could only enable copper deposition on/within the polymer matrix, which largely limited the application scope of 3D customized electronics. Accordingly, an advanced LASELP-based HAM technology combining vat photopolymerization (VPP), laser-activation and electroless silver plating (ELP) is proposed to pattern silver layers on the photopolymer matrix, for expanding its application potential in the field of 3D electronics. Cu2(OH)PO4 is selected as the catalyst in this HAM technology, which has been proven effective for copper-based LASELP in our previous research. After laser activation, silver ELP can directly occur on the activated surface to deposit a dense and highly conductive layer. Finally, a 3D conformal anti-corrosion circuit board is fabricated and fully verifies this improved LASELP-based HAM technology.