Artificial intelligence (AI)-enabled three-dimensional (3D) integration brings new possibilities and prospects by incorporating AI techniques into the process of stacking and linking several integrated circuits (ICs) in a 3D arrangement. Design optimization, thermal management, testing and fault diagnosis, yield enhancement, reliability prediction, and performance enhancement are just a few of the areas where AI is crucial in 3D integration. The design of 3D ICs can be optimized by AI-driven algorithms and models, resulting in increased performance and interconnectivity. Additionally, AI aids in testing and identifying the 3D integration flaws, minimizing manual intervention, and enhancing accuracy. Altogether, the integration of AI techniques unlocks the full potential of 3D integration, overcoming challenges and paving the way for advanced electronic systems in various domains. This chapter offers a profound exploration of the diverse techniques and technologies utilized in 3D packaging, unraveling its multifaceted nature. In addition, it unveils the integration of AI in 3D integration, encompassing its role in concept generation, design capture, physical design, manufacturing, packaging, and testing. By delving into these domains, this chapter provides comprehensive insights into the seamless amalgamation of AI and 3D integration, enabling enhanced design efficiency, precision, and reliability and captivating the minds of researchers and practitioners alike.