Delamination Detection by Thermal Contact Resistance Identification

Our study focuses on multilayer electronic components. With technological development, these components have become very miniaturized and always undergo very high powers that can cause a detachment between the layers. This is the delamination phenomenon which can be modeled by thermal contact resistances. This work is dedicated to the estimation of the thermal contact resistance at the contact interface in a multilayer electronic structure while studying the impact of the measurement sensor position. The identification is done in 2D by the inverse method of Levenberg Marquardt based on the minimization of a cost function. The results are satisfactory and converge towards the minimum expected, and subsequently, they guarantee a good identification of the thermal contact resistance.