SPECSIL tapes were developed under the Leader program no. LIDER/9/0028/L-11/19/NCBR/2020 financed by the National Center for Research and Development. The aim of the project was to develop a technology for producing silicone self-adhesive adhesives (Si-PSA) for special applications. All assumed goals in the project were successfully achieved. Adding silica fillers, such as halloysite or silica, allowed obtaining adhesive tapes with relatively high thermal resistance (up to 300 °C). The new silicone pressure-sensitive adhesives (Si-PSA), with improved thermal resistance, could find many applications, e.g. in. the heavy and automotive industry as connecting strips for operation at elevated temperatures; in heating—for covering installations and fireplaces, in thermal printing technology; for combining solar batteries; in the aviation industry on board satellites and space stations or in households for attaching elements exposed to elevated temperatures. Innovative Si-PSA were obtained based on commercial silicone resins. The project focused in particular on the physical modification of commercial silicone self-adhesive resin with cross-linking compounds, silicone fillers (including those modified according to one of the stages), and adhesion promoters. A technology for obtaining self-adhesive products with increased thermal resistance has been developed.

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SPECSIL—Silicone Pressure-Sensitive Adhesives for Special Applications—Summary of the Project

  • Adrian Krzysztof Antosik,
  • Karolina Mozelewska,
  • Konrad Gziut,
  • Mateusz Weisbrodt,
  • Agnieszka Kowalczyk,
  • Katarzyna Wilpiszewska,
  • Edyta Kucharska,
  • Marlena Musik,
  • Agata Kraśkiewicz,
  • Magdalena Zdanowicz,
  • Piotr Miądlicki

摘要

SPECSIL tapes were developed under the Leader program no. LIDER/9/0028/L-11/19/NCBR/2020 financed by the National Center for Research and Development. The aim of the project was to develop a technology for producing silicone self-adhesive adhesives (Si-PSA) for special applications. All assumed goals in the project were successfully achieved. Adding silica fillers, such as halloysite or silica, allowed obtaining adhesive tapes with relatively high thermal resistance (up to 300 °C). The new silicone pressure-sensitive adhesives (Si-PSA), with improved thermal resistance, could find many applications, e.g. in. the heavy and automotive industry as connecting strips for operation at elevated temperatures; in heating—for covering installations and fireplaces, in thermal printing technology; for combining solar batteries; in the aviation industry on board satellites and space stations or in households for attaching elements exposed to elevated temperatures. Innovative Si-PSA were obtained based on commercial silicone resins. The project focused in particular on the physical modification of commercial silicone self-adhesive resin with cross-linking compounds, silicone fillers (including those modified according to one of the stages), and adhesion promoters. A technology for obtaining self-adhesive products with increased thermal resistance has been developed.