Concerns about depletion of resources, climate change, and pollution drive the increasing importance of sustainable processes. Atomic layer deposition (ALD) is a highly versatile process that enables precise application of thin films onto difficult substrates, with the ability to modify thickness at the nanoscale level. The reason ALD is extensively utilized in many applications is due to its exceptional capacity to nanoengineer interfaces and surfaces. Although the ALD offers promise in addressing environmental issues, it is essential to prioritize efficiency and minimize the carbon footprint of renewable energy devices to guarantee their long-term sustainability [1]. Atomic layer deposition (ALD) is a thin film deposition process that sequentially introduces chemical precursors to the surface of a substrate, where they chemically react directly with the surface to generate submonolayers of film. As the name implies, it is atomic in nature, resulting in the precise deposition of films on the surface of a specified substrate at the atomic scale [2–7].