Effects of Cu Addition and Temperature on Hot Deformation Behavior of Al–Mg–Si 6201 Conductor Alloys
摘要
The study investigated the effect of a 0.3 wt.% Cu addition on the hot deformation behavior of an Al–Mg–Si conductor alloy and examined the influence of temperature on its performance. Hot compression tests were conducted at temperatures of 450 °C and 550 °C, with a constant strain rate of 0.1 s−1. Results from the tests at 450 °C revealed a 7.2% increase in peak flow stress compared to the base Al–Mg–Si alloy. Increasing the temperature to 550 °C resulted in a slight (<2%) peak stress increase for the alloy with 0.3 wt.% Cu. Microstructural analysis showed the formation of a significant amount of equilibrium precipitates after compression at 450 °C, while at 550 °C, these precipitates were mostly not present. Furthermore, samples deformed at 550 °C exhibited approximately 29 HV higher hardness after isothermal aging at 185 °C for 4 h, along with lower electrical conductivity compared to those deformed at 450 °C.