To better utilize the Si waste in photovoltaic (PV) module production, especially the kerf waste generated during the diamond wire sawing (DWS), hydrochloric acid (HCl) leaching as a purification method has been examined. The process parameters include HCl concentration, solid-to-liquid (S:L) ratio, and leaching period. The composition of the samples was determined via X-ray diffraction (XRD), and inductively coupled plasma optical emission spectroscopy (ICP-OES) which revealed the presence of Al and Fe impurities. Leaching with HCl shows promising results in terms of impurity removal from silicon, which in turn leads to potential application in various industries.