Dynamic Operation Modeling of Flat-Plate Pulsating Heat Pipes for Power Electronic Applications

Flat-plate pulsating heat pipes (FPPHPs) are a promising technology for the thermal management of power electronics as they can be integrated into thin layers of the substrate structure. By means of a thermally self-driven internal two-phase flow the limitations of thermal conduction through solids in conventional structures can be mitigated. However, in real power electronic applications of traction inverters, the heat dissipation highly varies over time according to the mission profile. Therefore, the aim of the present work is to evaluate the junction temperature response of thermal pulse square waves in a chip based on a FPPHP. The experimental setup is modeled by a FEA approach to assess the physics of the FPPHPs transient heat transfer characteristics. Finally, the dynamic behavior is modeled by a systems identification approach, which allows to monitor the operation by implementation on an electronic control unit.