Non-contact Measurement of Chip Seal Chipping Loss
摘要
Chip-seal is probably the most widely used surface treatment in the world. Methods for assessing chip seal problems such as chipping loss are dated and rely on qualitative assessment. This paper considers a non-contact method to measure this failure. The method assesses 3d models created and analyzed using UUTex3d. The method of 3d model creation and assessment is summarized. The evolution of areal parameters due to chipping loss is discussed.