Sustainable Pbps Co-packaged Optics Using Passively Assembled, Flip-Chip Evanescent Couplers

A passively assembled chip-to-interposer evanescent coupler between silicon nitride and silicon was experimentally demonstrated with a 0.33 ± 1.03 dB coupling loss at 1550 nm, a 160 nm 1-dB wavelength tolerance (1480–1640 nm), and a 1-dB lateral alignment tolerance of ± 1.56 \(\mu \) m. The thermal stability was evaluated from 23–60 \(^{\circ }\) C with average coupling loss and alignment tolerance varying by less than ± 0.35 dB and ± 30 nm, respectively. Finally, repeatability was evaluated across four packaged systems, demonstrating a coupling loss range of 1.5 dB. Together, these results show this coupler can help achieve future Pbps co-packaged optics input/output.