Characterization of TiN Coatings on cpTi Substrates

nPVD is a variation of physical vapour deposition (PVD) that has found application, for example, in the deposition of thin binary coatings such as SiO2 or TiO2. In the case of layers applied to the surfaces of products intended to come into contact with blood, the important determinants, in addition to the chemical composition, are obtaining the right thickness and proper sealing. A safe layer of sufficient thickness creates an effective barrier that protects the metal nanomaterial from corrosive environments. The use of PVD-based methods allows easy control of the layer thickness through a self-limiting growth process, meaning that the layer thickness depends only on the duration of the process. Thin oxide layers based on elements such as Ti or Si are more hemocompatible, which significantly reduces the risk of complications related to the coagulation process. For this reason, a study was carried out on the mechanical and electrochemical properties of TiN layers deposited on the surfaces of cpTi (grade 2) specimens by the nPVD method under varying process parameters. As part of the study, potentiodynamic measurements were performed to assess pitting corrosion resistance. In addition, impedance measurements were performed to allow interpretation of processes and phenomena occurring at the TiN layer-electrolyte interface. In addition, measurements of film-to-substrate adhesion were performed. These results provide direct support for the optimization of TiN layer formation by nPVD methods on the surfaces of cpTi (grade 2) samples intended for blood contact, improving their performance properties.