Wound Care Applications
摘要
Chronic wounds, such as diabetic foot ulcers and pressure injuries, represent a significant global healthcare challenge, primarily due to the prevalence of polymicrobial biofilms and the rise of antimicrobial resistance. These factors severely impede the healing process and undermine the efficacy of conventional antibiotic therapies. Antimicrobial photoinactivation technologies, including photodynamic therapy, photothermal therapy, and emerging multimodal approaches, have attracted increasing interest as adjunctive or alternative strategies for wound care. These techniques rely on the activation of photosensitizers or photothermal agents by specific wavelengths of light and ambient oxygen to generate reactive oxygen species or localized heat, leading to broad-spectrum microbial destruction with a low risk of inducing resistance. Beyond the antimicrobial effect, these technologies appear to influence the wound microenvironment by promoting re-epithelialization, supporting neovascularization, and modulating local inflammation. This chapter reviews the current state of antimicrobial photoinactivation in wound care, summarizing recent evidence, mechanistic insights, and technological developments. Notable advances include hydrogel or nanofiber dressings that improve photosensitizer stability and retention, theragnostic platforms that integrate infection sensing with on-demand phototherapy, and combination strategies such as photo-sonodynamic therapy to enhance penetration and combat biofilm-associated pathogens. Despite these promising developments, several challenges remain, including standardization of dosimetry, optimization of delivery strategies, and integration with existing wound care pathways. Overall, recent evidence indicates that antimicrobial photoinactivation is moving toward a more defined role as an adjunctive or alternative therapy for managing infected and biofilm-associated wounds, with continued progress dependent on well-designed clinical trials and translational research.