Photonic Integration Advancements in Miniaturizing High Reliability LIDAR System Components
摘要
Developing space-borne LIDAR for small satellite platforms requires miniaturization, ruggedization and high reliability of optoelectronic components. Lower size, weight and power (SWaP) LIDAR systems are achievable using monolithic photonic integrated circuit (PIC) platforms, hybrid photonic integration, and advanced photonic and electronic module packaging. Freedom Photonics’ monolithic InP PIC platforms, at wavelengths from 1250 to 1800+ nm, can integrate tunable lasers, amplifiers, modulators, detectors and more, in a chip with <1 cm2 footprint. Our photonic wirebonding capabilities enable integration of aura amplifiers, boosting output power to >1 W. High sensitivity avalanche photodetectors facilitate longer range detection, and high speed photodetectors can be used for offset locking. Additional capabilities are added by our InstaTune laser control module supporting wavelength stepping and stabilization within 200 ns. Proving in the reliability of these components, particularly transmitter PICs, high power amplifiers and photonic wirebonds, is currently a major effort at Freedom Photonics, with promising preliminary results.