Molecular Dynamic Study of Dependency on Mechanical Characteristic of Nanocrystalline Copper over Various Temperature and Strain Rate

Nanocrystalline copper is one of the best suited materials for integrated chips industries due to its high mechanical stability and less resistivity. In the present work, the molecular dynamic simulation approach is employed to analyze the mechanical properties and potential energy of single crystal nano copper. The response of temperature as well as strain rate on selective properties has been explored. Nanocrystalline copper deformation under virtual uniaxial tensile test has demonstrated that the increase in strain rate from 1.0 × 108/s to 5.0 × 1010/s provides a significant change in mechanical properties of nano copper. In addition, the outcomes reveal that the mechanical properties of crystalline nano copper degraded with temperature response under uniaxial tensile loading. With increasing temperature from 50 to 500 K, potential energy response shows an increase in instability of structure at higher temperatures. The results may help to accelerate functional applications of nanocrystalline copper at high temperatures subjected to a different levels of strain rates.