Time Domain Analysis of Skin Effect in Nonuniform Interconnection Using the FDTD Technique
摘要
During the last decades, manufacturers have opted for the miniaturization of electronic devices as an answer to high-performance equipment demand. However, Downscaling the Integrated Circuit (IC) technology has several side effects on the device’s performance. Considered one of the IC problems in the design, the skin effect impacts the IC design. In addition, high clock frequency can lead to severe Electromagnetic Compatibility (EMC) issues. The present work has used an efficient numerical method for transient analysis based on the Finite Difference Time Domain (FDTD) Method to investigate the previous phenomenon. It is used to examine the skin and incident electromagnetic field effect on the signals applied in non-uniform submicron CMOS interconnects. We have selected two research situations of non-uniform interconnects loaded by linear terminals, either in the absence or presence of an incident field. The MATLAB tool is used to implement the proposed algorithms. The outcomes are contrasted with PSPICE’s results. A close match was obtained between the two results.