Assembly of Solder Beads with a Surface Mount Technology Resistor with Optoelectronic Tweezers and Freezing-Drying Techniques

This research explores the use of optoelectronic tweezers (OET) as a method of manipulating microparticles. It focuses on how the dielectrophoretic (DEP) force can be used to trap solder beads with different concentrations of solution in an OET device, achieving velocities of up to 1350 μm/s. This study analyzes new techniques for creating complex patterns and examines how they are affected by various parameters, including light intensity, pattern size, and solution conductivity, to manipulate particles into desired structures. The freezing-drying technique has been used to fix solder beads with a surface mount technology (SMT) resistor to construct an electronic circuit, and we found that the freezing stage was sufficient when using Peltier to fix the assembled circuit. The paper discusses the temperature and time required for the heating process to connect the circuit by partially melting the solder and measures and analyzes the I-V characteristics to determine the manufactured device's resistance compared to the installed resistor. Overall, this study presents a promising result for microparticle manipulation and demonstrates its potential application in micro-electronic circuit construction or reworking.