Temperature Effect in the Nickel-Superalloy Forming Process by Solid-State Bonding

For those large-size components used in oil, chemical, aerospace, or nuclear industries, a novel solid-state additive manufacturing(AM) by piling up and bonding pre-shaped thick plate layers appears as a potential technology [1]. Apart from high efficiency and lower materials wastage, solid-state AM can avoid some solidification defects in traditional AM, like hot cracks and dendritic microstructure. The sound bonding between layers is achieved by hot-deformation method. The combination of high temperature and large plastic deformation would lead to severe microstructure evolution and break-up of the oxide films, which facilitates the full recovery of the joint performance to base level. For this new manufacturing method, the quality of the bonded interface and its dependence on the deformation condition would be the key focus. In this work, the effects of temperature on the bonding quality is investigated with IN718 samples using Gleeble. The tensile results of the bonded samples show comparable properties with the references.