Thermal Characteristics of a Modular Additive Enclosing Structure

The object of the study is a modular wall panel made on a 3D printer. Previously, this sample was tested in climatic chambers. The aim of the study is to assess the energy efficiency potential of the additive structure under study based on a more detailed analysis of the data obtained from the experiment in the climatic chamber and the thermal imaging performed. The work uses numerical and analytical methods. The heat transfer coefficient was calculated based on the data on the distribution of temperature and heat flux over the surface. The heat transfer coefficient U is equal to 0.464 W/m2 °C. This value is higher than the normative value for Saint- Petersburg, Russia (climate zone according to the Köppen-Geiger climate classification is Dfb). For the comfortable use of these modular additive panels, it is necessary to additionally insulate them. An analysis of thermal imaging of the additive structure showed that the temperature is distributed unevenly over the surface. Under the same conditions, the temperature variation can be more than 10 °C. This factor can significantly affect the overall heat transfer coefficient of the structure.