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<p class="MsoNormal" style="background: white;"><span lang="EN-US" style="mso-ascii-font-family: Calibri; mso-fareast-font-family: Calibri; mso-hansi-font-family: Calibri; mso-bidi-font-family: Calibri; color: #1f3864; mso-ansi-language: EN-US; mso-fareast-language: EN-IN; mso-no-proof: yes;">This book consists of ten chapters on IC packaging technologies, covering failure modes, mechanisms, advanced structures and reliability methods, with a focus on materials, structure and stress.</span></p><p class="MsoNormal" style="background: white; background-image: initial; background-position: initial; background-size: initial; background-repeat: initial; background-attachment: initial; background-origin: initial; background-clip: initial;"><span lang="EN-US" style="mso-ascii-font-family: Calibri; mso-fareast-font-family: Calibri; mso-hansi-font-family: Calibri; mso-bidi-font-family: Calibri; color: #1f3864; mso-ansi-language: EN-US; mso-fareast-language: EN-IN; mso-no-proof: yes;">Reliability, a key indicator of product quality, spans multiple disciplines such as materials science and electronics. In China's pursuit of "high-quality development" a focus on reliability is essential to advancing manufacturing.</span></p><p class="MsoNormal" style="background: white; background-image: initial; background-position: initial; background-size: initial; background-repeat: initial; background-attachment: initial; background-origin: initial; background-clip: initial;"><span lang="EN-US" style="mso-ascii-font-family: Calibri; mso-fareast-font-family: Calibri; mso-hansi-font-family: Calibri; mso-bidi-font-family: Calibri; color: #1f3864; mso-ansi-language: EN-US; mso-fareast-language: EN-IN; mso-no-proof: yes;">Written by a leading expert from the State Key Laboratory, this book is important for improving the performance of electronic products and supporting the growth of China's electronic information industry.</span></p>

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Reliability Technology for Integrated Circuit Packaging

  • 书籍

  • 发表日期：

    2026年

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  • Bin Zhou,
  • Yunfei En,
  • Si Chen

摘要

This book consists of ten chapters on IC packaging technologies, covering failure modes, mechanisms, advanced structures and reliability methods, with a focus on materials, structure and stress.

Reliability, a key indicator of product quality, spans multiple disciplines such as materials science and electronics. In China's pursuit of "high-quality development" a focus on reliability is essential to advancing manufacturing.

Written by a leading expert from the State Key Laboratory, this book is important for improving the performance of electronic products and supporting the growth of China's electronic information industry.