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Abstract <p>The article considers the problem of spatial alignment of layers of multilayer printed circuit boards (MPCBs) in conditions of increasing interconnect density. An automated method for estimating the deformation of layers is proposed, based on comparing the positions of reference holes in the images of the printed circuit board before and after technological operations, for which special software has been developed. The algorithms presented in the article can be used as a basis for further study of deformation assessment methods not only for MPCBs, but also for other objects and structures made of composite materials.</p>

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Development of a Method for Digital Assessment of Conductor Layers Deformation in Multilayer Printed Circuit Boards during Their Manufacturing

  • 期刊论文

  • 发表日期：

    2025年7月1日

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  • A. S. Stepanov,
  • S. A. Lavrinenko,
  • S. A. Prokofiev,
  • M. A. Korobkov,
  • O. V. Khomutskaya

摘要

Abstract

The article considers the problem of spatial alignment of layers of multilayer printed circuit boards (MPCBs) in conditions of increasing interconnect density. An automated method for estimating the deformation of layers is proposed, based on comparing the positions of reference holes in the images of the printed circuit board before and after technological operations, for which special software has been developed. The algorithms presented in the article can be used as a basis for further study of deformation assessment methods not only for MPCBs, but also for other objects and structures made of composite materials.