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Abstract <p>Hot dip tinning of copper wire by POIn-52 solder is considered. A regression model of the coating thickness as a function of the linear velocity and the melt temperature is proposed. The dependence of the coating thickness on the tinning conditions is derived. Optimal conditions of coating application are identified.</p>

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Coating Thickness in Hot Dip Tinning of Copper Wire by POIn-52 Solder

  • 期刊论文

  • 发表日期：

    2025年4月1日

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  • A. O. Pat’yanova,
  • M. V. Kuz’min,
  • V. L. Semenov,
  • E. A. Mikishanina

摘要

Abstract

Hot dip tinning of copper wire by POIn-52 solder is considered. A regression model of the coating thickness as a function of the linear velocity and the melt temperature is proposed. The dependence of the coating thickness on the tinning conditions is derived. Optimal conditions of coating application are identified.