Mathematical Model of Residual Stress Formation during Flat Grinding with a Single Grain

This work presents a mathematical model for flat grinding during the processing of thin-walled workpieces. The analysis focuses on single cutting by an abrasive grain. A method for determining the unit cutting force is described, based on calculating the area of the chip removed by the grain. The residual stresses in the tangential direction are derived as a function of the applied force. It has been established that increasing the grinding speed decreases both cutting forces and residual compressive stresses. Furthermore, it is shown that the grinding temperature induces residual tensile stresses in the surface layer. The total distribution of residual stresses during flat grinding is influenced by processing parameters and the interaction between thermal and mechanical fields in the cutting zone.