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Influence of the Substrate Thickness in Elastoplastic Deformation of a Microprofile under Orthogonal Constrained Loading

  • N. V. Vulykh

摘要

Abstract

Local plastic surface deformation of parts after cutting is investigated. It is shown that, with variation in the substrate thickness, the reshaping of the microprojections when the deformation is comparable with the height of the initial profile affects the following parameters: the inclination at the base of the microprojection, the relative length of the smoothed section, and the displacement of the microprofile’s trough during constrained loading.