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<p>This study employs COMSOL Multiphysics simulations to compare the thermo-mechanical stress behaviors of sandwich structures formed by double-layer Ajinomoto Build-up Film (ABF) on glass and resin substrates. Simulation results indicate that intrinsic properties of materials play crucial roles in interfacial stress, such as Young’s modulus, coefficient of thermal expansion (CTE), and Poisson’s ratio. Due to a large CTE mismatch, the stress levels in resin substrates bonded with resin-based ABF are markedly lower than those in glass substrate. Nevertheless, the stress growth of glass substrates with increasing power (approximately 150%–180% per 100 W) is gentler than that of resin substrates (approximately 200%–250% per 100 W), reflecting superior dimensional stability of glass. Furthermore, the through-hole arrays introduced in glass substrates can realize effective stress control, reducing stress around two orders of magnitude. This work offers theoretical and design guidance on optimizing glass substrates and controlling stress for high-performance packages.</p> Graphical abstract <p>Compare thermo-mechanical stress behaviors of double-layer Ajinomoto build-up film (ABF) sandwich structures on glass and resin substrates via COMSOL Multiphysics simulations, to guide high-performance package design.</p> <p></p>

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Stress analysis of glass substrates vs. resin substrates in double-layer ABF sandwich structures

  • 期刊论文

  • 发表日期：

    2026年1月20日

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  • Wenzhen Wei,
  • Xiangli Qin,
  • Qingran Hou,
  • Zhaowei Wang,
  • Weili Zhang,
  • Li Ma,
  • Xiansheng Tang

摘要

This study employs COMSOL Multiphysics simulations to compare the thermo-mechanical stress behaviors of sandwich structures formed by double-layer Ajinomoto Build-up Film (ABF) on glass and resin substrates. Simulation results indicate that intrinsic properties of materials play crucial roles in interfacial stress, such as Young’s modulus, coefficient of thermal expansion (CTE), and Poisson’s ratio. Due to a large CTE mismatch, the stress levels in resin substrates bonded with resin-based ABF are markedly lower than those in glass substrate. Nevertheless, the stress growth of glass substrates with increasing power (approximately 150%–180% per 100 W) is gentler than that of resin substrates (approximately 200%–250% per 100 W), reflecting superior dimensional stability of glass. Furthermore, the through-hole arrays introduced in glass substrates can realize effective stress control, reducing stress around two orders of magnitude. This work offers theoretical and design guidance on optimizing glass substrates and controlling stress for high-performance packages.

Graphical abstract

Compare thermo-mechanical stress behaviors of double-layer Ajinomoto build-up film (ABF) sandwich structures on glass and resin substrates via COMSOL Multiphysics simulations, to guide high-performance package design.