Fe gettering behavior in proximity gettering silicon epitaxial wafer using SiHx and C2Hy mixture molecular ion implantation
摘要
We have reported that mixture molecular ion-implanted region changes with the type of defects in the molecular ion-implanted region depending on the molecular ion ratio (CH+ ratio). In the case of Ni gettering, the gettered amount of Ni by segregation is proportional to the CH+ ratio. However, the effects of defect type on other metallic impurities have not been investigated. In this study, we investigated the Fe gettering behavior of the mixture molecular ion-implanted region. As a result, we found that the Fe gettering behavior is also affected by the CH+ ratio. In low CH+ ratio, the gettering amount is higher in low-temperature annealing. At a high CH+ ratio, gettering amount is higher in high-temperature annealing. These findings are useful for realizing the full use of the gettering capability of the mixture molecular ion-implanted region in highly sensitive CMOS image sensors.
Graphical abstract