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Air-sintered copper-nickel resistor with aluminum layer for oxidation prevention

  • Wen-Hsi Lee,
  • S. W. Chang,
  • Narendra Gharini Puteri

摘要

By applying an aluminum coating to the copper-nickel alloy resistor, we successfully utilized air sintering. At 800 and 850°C, the alloy was sintered within an aluminum layer. This coating of aluminum serves as a protective layer. The copper-nickel was not oxidized as a result. After wet etching, the protective coating of aluminum was removed, leaving alloy resistors with Temperature Coefficient of Resistance (TCR) values of 417.86 ppm/°C. We produced an alloy paste using copper-nickel alloy (7:3) and then used screen printing to create thick-film alloy resistors. Therefore, it is feasible to create copper-nickel alloy resistors by air sintering.

Graphical abstract