Tailoring microstructure and performance of Cu/steel bimetallic laminated composites by Bi content and bonding time regulation
摘要
Cu-12Sn-xBi-2Ni-1Fe/steel (x = 2, 6wt%) bimetallic laminated composites (BLCs) with robust interfacial bonding were prepared by solid–liquid composite process. Microstructural analysis reveals that extending the bonding time from 1 to 5 min induces a slight grain size coarsening at interface, with a more dispersed distribution of the intergranular Bi-rich phase observed in the 6 wt% Bi alloys. CALPHAD calculations and observations confirm the time-dependent growth of a distinct Cu/Fe diffusion layer at the interface, with its thickness increasing as the bonding time is prolonged. The coefficient of friction demonstrates a sensitive reduction with increased Bi content and bonding time, while the wear rate exhibits a non-linear dependence on these parameters. The BLCs with lamellar eutectoid copper alloy on one side and a quenched-tempered steel on the other side were obtained by quenching and tempering treatment. A moderate reduction in Bi content is necessary to prevent quenching cracks while maintaining acceptable friction properties.
Graphical abstract