Size-dependent fracture behavior of copper: An in situ transmission electron microscopy insight
摘要
To ensure high reliability of in-service metal components and devices, it is important to explore and clarify their deformation and fracture behaviors. In this study, in situ TEM technique was applied to investigate the dynamic behavior of nano-sized copper. Firstly, when tensioning was applied to the sample along < 200 > direction, the system exhibited two paths of fracture propagation, the cleavage fracture and normal fracture. The analysis of fracture surfaces and molecular dynamics simulation demonstrated that dislocations and slips appeared mainly in cleavage region while in the normal fracture region, the microstructure was characterized by severe lattice distortion, localized amorphization and polycrystallization. Our findings reveal a high sensitivity to copper thickness—approximately 38 nm (the average thickness for cleavage fracture) to 52 nm (the average thickness for normal fracture)— that triggers the transition between cleavage and normal fracture modes, providing insights into the crack propagation and damage mechanisms of metallic copper.
Graphical abstract