<p>The Al-Cu bimetals have excellent advantages such as light weight and high electrical and thermal conductivity. In this paper, A356-T2 bimetallic composite specimens were prepared by liquid–solid compound casting. The effects of pouring temperature and surface treatment for the T2 rod on the interfacial microstructure and mechanical properties of the specimens were investigated. Results indicate that effective metallurgical bonding can be achieved at the bimetallic interface while a surface treatment of Ni plating is used for the T2 rod, combing with a pouring temperature of 730 ℃. The interfacial transition layer primarily consists of α-Al, the [α-Al + Al<sub>2</sub>Cu] eutectic and various intermetallic compounds (IMCs). The microhardness of the interfacial transition layer is higher than that of the Cu and Al sides. A maximum shear strength of 53.4 MPa is achieved under a pouring temperature of 730 ℃ and Ni plating time of 5 min.</p> Graphical abstract <p></p>

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Interfacial microstructure and mechanical properties of Al-Cu bimetal fabricated by liquid–solid compound casting

  • Hong Zheng,
  • Chang-li Liu,
  • Qi Gao,
  • Meng-wu Wu,
  • Xun-peng Qin

摘要

The Al-Cu bimetals have excellent advantages such as light weight and high electrical and thermal conductivity. In this paper, A356-T2 bimetallic composite specimens were prepared by liquid–solid compound casting. The effects of pouring temperature and surface treatment for the T2 rod on the interfacial microstructure and mechanical properties of the specimens were investigated. Results indicate that effective metallurgical bonding can be achieved at the bimetallic interface while a surface treatment of Ni plating is used for the T2 rod, combing with a pouring temperature of 730 ℃. The interfacial transition layer primarily consists of α-Al, the [α-Al + Al2Cu] eutectic and various intermetallic compounds (IMCs). The microhardness of the interfacial transition layer is higher than that of the Cu and Al sides. A maximum shear strength of 53.4 MPa is achieved under a pouring temperature of 730 ℃ and Ni plating time of 5 min.

Graphical abstract