Scholarlink

<p>The lead-frame C19400 strips are warped during the etching process due to the presence of the residual stress. Following annealing at 300&#xa0;°C for 5 min, the residual stress decreased from 125.9 MPa (rolling direction, RD) and 137.1 MPa (transverse direction, TD) to 13.2 MPa (RD) and 16.5 MPa (TD). Following annealing at 500&#xa0;°C, the alloy undergoes incomplete recrystallization. Moreover, there is a significant plastic mismatch between the “soft orientation” (Cube (001)&lt;100&gt;) and the “hard orientation” (S (123)&lt;634&gt; and Copper (112)&lt;111&gt;), resulting in an increase in residual stress. Furthermore, as the temperature increases, the <InlineEquation ID="IEq1"> <InlineMediaObject> <ImageObject Color="BlackWhite" FileRef="43578_2025_1580_Article_IEq1.gif" Format="GIF" Height="10" Rendition="HTML" Resolution="72" Type="Linedraw" Width="14" /> </InlineMediaObject> <EquationSource Format="TEX">\(\alpha\)</EquationSource> <EquationSource Format="MATHML"><math> <mi>α</mi> </math></EquationSource> </InlineEquation>-Fe precipitates grow from 31 nm at 300&#xa0;°C to 82 nm at 500&#xa0;°C and maintain the semi-coherent relationship with the Cu matrix. The growth of <InlineEquation ID="IEq2"> <InlineMediaObject> <ImageObject Color="BlackWhite" FileRef="43578_2025_1580_Article_IEq1.gif" Format="GIF" Height="10" Rendition="HTML" Resolution="72" Type="Linedraw" Width="14" /> </InlineMediaObject> <EquationSource Format="TEX">\(\alpha\)</EquationSource> <EquationSource Format="MATHML"><math> <mi>α</mi> </math></EquationSource> </InlineEquation>-Fe precipitates will lead to more plastic mismatch.</p> Graphical abstract <p></p>

错误：搜索内容不能为空，请输入英文关键词
错误：关键词超出字数限制，请精简
高级检索

Relation between residual stress and microstructure evolution in C19400 alloy based on different annealing parameters

  • 期刊论文

  • 发表日期：

    2025年4月15日

查看全文
  • Taifeng Cao,
  • Yuhui Guo,
  • Shaohua Wang,
  • Peter K. Liaw,
  • Junwei Qiao

摘要

The lead-frame C19400 strips are warped during the etching process due to the presence of the residual stress. Following annealing at 300 °C for 5 min, the residual stress decreased from 125.9 MPa (rolling direction, RD) and 137.1 MPa (transverse direction, TD) to 13.2 MPa (RD) and 16.5 MPa (TD). Following annealing at 500 °C, the alloy undergoes incomplete recrystallization. Moreover, there is a significant plastic mismatch between the “soft orientation” (Cube (001)<100>) and the “hard orientation” (S (123)<634> and Copper (112)<111>), resulting in an increase in residual stress. Furthermore, as the temperature increases, the \(\alpha\) α -Fe precipitates grow from 31 nm at 300 °C to 82 nm at 500 °C and maintain the semi-coherent relationship with the Cu matrix. The growth of \(\alpha\) α -Fe precipitates will lead to more plastic mismatch.

Graphical abstract