Electrochemical deposition of super-conductive Cu/MXene laminated composite foils with low thermal expansion coefficient

A novel Cu/Ti₃C₂T_X laminated composite foil was prepared using a combination of electroplating and electrophoretic deposition. The results indicate that the average thermal expansion coefficient of the Cu/ Ti₃C₂T_X composite foil decreased by 11.26% compared to that of pure copper. Due to the high electron mobility of Ti₃C₂T_X and the favorable Cu/ Ti₃C₂T_X interface, the electrical conductivity of the Cu/ Ti₃C₂T_X composite foil exceeded that of pure copper by 8.7%, reaching 6.2147 × 10⁷ S·m⁻¹, and its thermal conductivity increased from 381.5 W/m·K to 423.5 W/m·K. The study revealed that a thinner, looser Ti₃C₂T_X layer with fewer layers is more favorable for copper penetration and filling, enabling a continuous network-like structure and resulting in significantly improved thermal and electrical properties of the composite copper foil. These findings position the Cu/Ti₃C₂T_X foil as a promising candidate for electronic encapsulation and super-conductivity.