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<p>The purpose of this study is to report a low-cost electroless deposition (EN) process of Ni-P thin films using a wet-chemical process on flexible polyimide substrate (Kapton<sup>®</sup> 300HN DuPont™), comprising surface functionalization with NaOH, nucleation with Sn and Pd, and acceleration with HCl. The pretreatment performed on the polyimide surface was investigated using a contact angle system and Fourier-transform infrared spectroscopy (FTIR). Structural, morphological and electrical characterization of the Ni-P film were performed by X-ray diffraction (XRD), stylus scan profiler, scanning electron microscopy (SEM), X-ray photoelectron spectroscopy (XPS), and four-point probe measurements. The results showed that the pretreatment of the flexible polyimide enables a faster EN process, with lower thermal expenses, delivering a compact, spherical shaped Ni-P film -free of holes, scratches, and flaws, with particle size ranging from 380 to 780&#xa0;nm.</p> Graphical abstract <p></p>

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Electroless Ni-P deposition on flexible polyimide substrates with tin-palladium nucleation

  • 期刊论文

  • 出版模式：

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  • 发表日期：

    2026年2月7日

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  • Marcelo Kioshi Hirata,
  • Andreia de Morais,
  • Alexander Flacker,
  • Michele Odnicki da Silva,
  • Jilian Nei de Freitas,
  • Ricardo Cotrin Teixeira

摘要

The purpose of this study is to report a low-cost electroless deposition (EN) process of Ni-P thin films using a wet-chemical process on flexible polyimide substrate (Kapton® 300HN DuPont™), comprising surface functionalization with NaOH, nucleation with Sn and Pd, and acceleration with HCl. The pretreatment performed on the polyimide surface was investigated using a contact angle system and Fourier-transform infrared spectroscopy (FTIR). Structural, morphological and electrical characterization of the Ni-P film were performed by X-ray diffraction (XRD), stylus scan profiler, scanning electron microscopy (SEM), X-ray photoelectron spectroscopy (XPS), and four-point probe measurements. The results showed that the pretreatment of the flexible polyimide enables a faster EN process, with lower thermal expenses, delivering a compact, spherical shaped Ni-P film -free of holes, scratches, and flaws, with particle size ranging from 380 to 780 nm.

Graphical abstract