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<p>Soft electronic devices require durability to endure their inherent exposure to diverse mechanical deformations, including scratches, punctures, and repeated bending. Without intrinsic damage recovery mechanisms, such deformations inevitably compromise mechanical integrity and limit device lifetime. To address this issue, the strategic incorporation of reversible dynamic bonds enables autonomous self-healing while simultaneously achieving high mechanical toughness through energy dissipation during bond rupture. To this end, optimizing the glass transition temperature and bond exchange kinetics is essential to ensure sufficient chain mobility for rapid interfacial diffusion and autonomous mechanical recovery. Building on the reversible bond nature, this review presents emerging self-healable and tough soft electronics applications in three major areas: (1) Multimodal electronic skins capable of comprehensive physiological signal sensing; (2) modularly reconfigurable systems with adhesive-free interlayer bonding that enable user-on-demand device assembly; (3) optoelectronic devices that seamlessly integrate light-emitting and pressure-sensing capabilities. These applications demonstrate that dynamic bond engineering enables elastomeric devices to simultaneously achieve mechanical robustness, functional adaptability, and autonomous self-healing. Such advancements position them as durable platforms with extended operational lifetimes, paving the way for next-generation wearable and implantable bioelectronics in real-world applications.</p> Graphical abstract <p></p>

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Design guidelines for self-healing materials in soft electronics

  • 期刊论文

  • 出版模式：

    开放获取

  • 发表日期：

    2026年5月2日

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  • Chan Beom Park,
  • Gunho Chang,
  • Jooyeun Chong,
  • Jiheong Kang

摘要

Soft electronic devices require durability to endure their inherent exposure to diverse mechanical deformations, including scratches, punctures, and repeated bending. Without intrinsic damage recovery mechanisms, such deformations inevitably compromise mechanical integrity and limit device lifetime. To address this issue, the strategic incorporation of reversible dynamic bonds enables autonomous self-healing while simultaneously achieving high mechanical toughness through energy dissipation during bond rupture. To this end, optimizing the glass transition temperature and bond exchange kinetics is essential to ensure sufficient chain mobility for rapid interfacial diffusion and autonomous mechanical recovery. Building on the reversible bond nature, this review presents emerging self-healable and tough soft electronics applications in three major areas: (1) Multimodal electronic skins capable of comprehensive physiological signal sensing; (2) modularly reconfigurable systems with adhesive-free interlayer bonding that enable user-on-demand device assembly; (3) optoelectronic devices that seamlessly integrate light-emitting and pressure-sensing capabilities. These applications demonstrate that dynamic bond engineering enables elastomeric devices to simultaneously achieve mechanical robustness, functional adaptability, and autonomous self-healing. Such advancements position them as durable platforms with extended operational lifetimes, paving the way for next-generation wearable and implantable bioelectronics in real-world applications.

Graphical abstract