Thermal Stability of the Microstructure of Rapidly Solidified Eutectic Al–Si Alloy Alloyed with Metals
摘要
The results of a study of the microstructure, elemental and phase compositions of a eutectic alloy Al–12.5 wt % Si–0.8 wt % Mg–0.4 wt % Mn–0.7 wt % Fe–0.9 wt % Ni–1.8 wt % Cu after Isochronal annealing for 1 h at 300, 400 and 500°C are presented. It is shown that annealing at 300°C does not lead to significant changes in the microstructure and phase composition of the foil. Increasing the annealing temperature to 400 and 500°C causes coarsening of the nanosized globular Si inclusions, as well as fragmentation of thin silicon plates and their spheroidization. Using X-ray spectral microanalysis and X-ray diffraction analysis, the decomposition of the Al3(NiCu)2 compound and the formation of intermetallics Mg5Si6, Al17(NiFeMn)Si2 and Al3Cu2 at 500°C were established. The diffusion mechanisms leading to the change in phase composition are discussed.