Modelling the Heating of Epoxy Compounds in Microwave Chambers of Different Types
摘要
Using the finite element method implemented in the COMSOL Multiphysics software package, numerical studies were conducted on the distribution of temperature and electric fields in an epoxy compound, taking into account heating modes, microwave chamber design, and the physical properties of the composite. It was established that for microwave heating of a compound containing ED-20 epoxy resin with a silicon carbide filler, it is advisable to use working microwave chambers with a quasi-coaxial waveguide and periodic waveguide-slot radiators. The optimal modes for the microwave curing process of the epoxy compound were determined: microwave exposure time, power, and the speed of rotation and movement of the mold with the compound in the microwave chambers. To achieve the required curing temperature of the epoxy compound, an algorithm for stepwise control of microwave power depending on the temperature at a control point was used, allowing for a uniform distribution of the temperature field in the volume of the compound and accelerating the technological process of obtaining the composite. The proposed approach to solving the problems of heating epoxy compounds in various types of microwave chambers and the simulation results can be used in the development of microwave chambers for curing and modification technologies of various compounds, as well as in the construction of algorithms and control systems for microwave installations.